Samsung bdc6500 bluray player
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Samsung BD-C6500 Blu-Ray Player
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Toshiba: 1.4mm MCP containing 9 layers of components
Toshiba announced the development
MCP enclosures 1.4mm high that can accommodate up to 9 layers of components
– during its development, the latest achievements of the company were used, in particular,
manufacture of memory chips with a height of 70 nm (smallest size for chips packed
in MCP). Until now, the height of the memory chips used in the company’s MCP,
was 85 nm. Thus, the new housing can accommodate up to 6 layers
memory chips with three separating layers. Still in 1.4mm MCP Toshiba
only six layers of components could be placed, that is, in terms of magnification
number of layers in one MCP, the company achieved 50% growth.
Any type of memory chips can be installed in the new Toshiba case,
including SRAM, SDRAM, Psuedo SRAM, NOR flash, NAND flash, etc.P.; in this way,
the total density of microcircuits in such a package can reach 776 Mbit. In addition to
saving space when placing components new enclosure “optimizes transmission
data between the central processor and the MCP through the use of a triple
data bus (triple-data bus system) “, when for each specific type
memory chips in the case have their own bus. Highest speed – y
buses for SDRAM and NOR-flash chips, medium speed – for SRAM and NOR-flash,
a separate bus is reserved for data exchange with NAND-flash.
Brief characteristics of the case:
- Chip Combination – 6 memory chips, three dividing layers
- Supported chips – SRAM (8Mb x 1), SDRAM (128Mb x 1), NOR Flash
Memory (128Mb x 3), NAND Flash Memory (256Mb x 1)
- Case dimensions – 11 x 14 x 1.4 mm
- Supply voltage – 1.8 V
- Number of contacts – 255 (FBGA)
- Three data bus system
Recall that one of the latest competitive developments of this kind are
allowing to place up to 6 layers of components.