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Hynix begins mass production of 256 Mbit chips using 0.11-micron technology

Korean memory manufacturer Hynix
Semiconductor, announced the start of serial production of 256 Mbit DDR SDRAM chips,
made using the standards of 0.11-micron technical process. Another step forward for
a surviving firm – so far, most chips have been produced using 0.13-micron technology.

Instead of building a new factory, the company modernized the existing line
– firstly, it made it possible to reduce additional costs, and, secondly, by 40%
increase line productivity. Recall that Farad Tabrizi, Vice President
Hynix Global Marketing, reported some time ago that next year
the company will launch a line processing 12 “plates.

By the way, just recently the Chinese print publication Economic Daily News reported,
that Hynix will transfer part of the production to the Chinese company GSMC (Grace Semiconductor
Manufacturing Corporation).According to the newspaper, Hynix plans to outsource production
DRAM chips at 0.11 micron standards. True, the official signing of the agreements is planned
not earlier than the end of this year.

GSMC begins 0.11-micron production at one of its two Shanghai
factories last April. The company’s productivity by the end of the year should be
about 10,000 200mm plates monthly. In the future, both factories can be refurbished
for the use of 300 mm plates.

Apparently, “in-line” production of memory chips using new technologies
and involvement of third-party companies in the production ? indicators of what Hynix is ​​planning
still compete for your market share and probably regain your third place
in the rating of manufacturers.

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