Asus z270-k.PRIME Z270-K


Asus z270-k


PRIME Z270-A.ASUS PRIME ZK – motherboard – ATX – LGA Socket – Z Specs – CNET


Mb Flash ROM, UEFI AMI BIOS, PnP, DMI, WfM, SM BIOS , ACPI , Multi-language BIOS, ASUS EZ Flash 3, CrashFree BIOS 3, F11 EZ Tuning Wizard, F6 Qfan Control, F3 My Favorites, Last Modified log, F12 PrintScreen, and ASUS DRAM SPD (Serial Presence Detect) memory informationCategory: Intel-Platform. ASUS PRIME ZK – motherboard – ATX – LGA Socket – Z overview and full product specs on : Asus. PRIME ZK specifications summary (continued on the next page) Specifications Storage Intel® Z Chipset with RAID 0, 1, 5, 10 and Intel Rapid Storage Technology 15 support – 1 x M.2 Socket 3 with M Key, type /// storage devices support (both SATA & x4 PCIE mode)*.


Asus z270-k.PRIME ZK | Motherboards | ASUS Global

Ready for 7th generation Intel Core processors, the Prime ZK delivers customizable performance. 5X Protection III with FanXpert 4 Core provides hardware-level safeguards. CrossFireX drives support for Multiple GPUs, while Dual M.2 slots and USB deliver maximum transfer speeds. Create your unique build with 3D printing mounts/5(26). The ASUS PRIME ZK is a good choice in the entry-level segment. Most importantly, it is stable and supports overclocking ASUS PRIME ZK can be safely recommended for purchase in order to build a modern but at the same time not the most expensive system with a single graphics card. ASUS Prime is the next evolution of the ASUS motherboard, born of a pedigree that stretches back to Our team of world-class engineers are passionate about empowering everyone to enjoy the benefits of customization and tuning, and the driving force behind the development of Prime is to make advanced enthusiast controls easily accessible — maximizing performance, stability and.
ASUS PRIME Z270-K – motherboard – ATX – LGA1151 Socket – Z270 Specs

PRIME ZK – Tech Specs|Motherboards|ASUS Global

PRIME ZK|לוחות אם|Asus Israel – אסוס ישראל
Toshiba unveils first functional 90nm silicon with X Architecture technology

The X Initiative, formed in the summer of 2021 to promote the technology of diagonal bonding between metallization layers in chip manufacturing, announced that group member Toshiba has released the first 90nm silicon with this architecture.

The essence of the new technology is to create special blocks (tiles) that use diagonal connections created using the “fluid routing” technology and allowing you to create an efficient diagonal routing system inside the block. The tiles are then joined using regular orthogonal connections. The very concept of tile technology was developed by ArTile, a subsidiary of Toshiba, back in 2021. Nowadays in the industry, rectangular wiring of “Manhattan” type connections is generally accepted.

Experimental Toshiba 5-layer metallization chips produced in Toshiba’s pilot 90nm factory using standard hardware and materials. It is especially emphasized that compared to the mainstream Manhattan technology, using the X Architecture to wire the same chip reduces the length of the connecting lines by 14%.

It only remains to add that Toshiba plans to start mass production of chips using X Architecture in 2021. As for the X Initiative working group, it now includes a decent number of reputable companies in the industry, for example, Applied Materials, ARM, Artisan Components, ASML, Cadence Design Systems, Dai Nippon Printing, DuPont Photomasks, Applied Materials, Leica Microsystems, Matsushita Electric Industrial , Nikon, Sanyo Electric, Silicon Valley Research, STMicroelectronics, Toppan Printing, Toshiba and others. For more information on the group’s materials, visit the X Initiative website.

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